High Speed Inter-Chip spec, a USB 2.0 supplement, available
Posted by Dennis Sellers 
Nov 14, 2007 at 12:00pm
The USB 2.0 Promoter Group, responsible for the development of the USB 2.0 specification with support from the USB Implementers Forum (USB-IF), has announced the public availability of the High Speed Inter-Chip (HSIC) 1.1 specification, a supplement to the USB 2.0 specification.
The new specification supports faster chip-to-chip communication, at speeds up to 480 Mbps, allowing for multiple high bandwidth operations on devices like 3G/4G handsets, smartphones, set-top boxes, mobile internet devices and connectivity within the computer. Defined to meet the increasing bandwidth needs of these devices, the specification allows the integration of multiple high speed capabilities, such as 3G/4G modems, WiMAX, 802.11n and storage peripherals, as well as other USB based input devices like keypads and control panels.
The HSIC permits the device to move data between the various components at higher bandwidth and with improved power efficiency, according to Jeff Ravencraft, USB-IF president. It also eliminates the need for analog PHYs by providing a digital signal interconnect between the SOCs and their IC peripherals, he adds. The HSIC specification remains fully compatible with existing USB software stacks and provides all data transfer needs through a single unified USB software stack.
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Dennis Sellers
Dennis has been a newspaper editor/reporter (seven years) and teacher (seven years). He has over 4,000 magazine, newspaper and online articles to his credit. He has also covered the Mac and tech industries for over a decade for such online publications as MacCentral, MacMinute and now MacsimumNews.
